Non-Silicone
Compound
TIM
400 Series non silicone compounds are formulated
with Synthetic fluids and highly conductive ceramic fillers. These
finely engineered compounds provide low bleed and solve the problems
of contamination and migration associated with silicone based products.They
offer better stability for a longer life cycle with high
thermal conductivity (3.7 W/m.°K) and low thermal
resistance (0.014 °C-in2/W).
TYPICAL
PROPERTIES |
| PRODUCT |
|
|
|
|
|
|
| VISCOSITY |
Thixotropic
Paste |
| Specific
Gravity, @25°C |
2.7 |
2.4 |
2.7 |
2.3 |
1.7 |
1.7 |
| Color |
Blue |
Blue |
Blue |
Gray |
Black |
Black |
| Evaporation,
@ 200°C, 24Hrs., %/Wt. |
0.3 |
0.6 |
0.5 |
0.6 |
0.2 |
0.2 |
| Thermal
Conductivity,
(ASTM D5470)
| W/m.
°K |
| Thermal
Resistance
°C-in2/W
|
|
|
|
|
|
|
|
| Electrical
Properties
| Dielectric
Strength.
(ASTM D150)
0.05" gap, V/mil |
| Volume
Resistivity.
(ASTM D257)
Ohm-cm. |
|
|
|
|
|
|
|
| Operating
Temperature Range |
-55°C
to 200°C |
|

|