TIM-800
Thermally Conductive Epoxies/Adhesives |
Product Description :
TIM-800 series are thermally conductive, electrically insulating epoxies engineered with highly conductive ceramic fillers and non silicone resins. They are designed for the demanding needs of die-attach heat sink bonding and surface mount applications. Rapid heat transfer properties eliminate hot spots and the low epoxy shrinkage factor minimizes the risk of damage to fragile components, resulting in increased operating efficiencies. Available in one part, two parts, heat curable and room temperature cure systems.
Typical Applications :
Fabricating heat sink, bonding semiconductors, substrate attach, lid seal, SMD attach, stacking components and die attach applications.
Most Popular Products :
• TIM-813: One part heat cure system, excellent conductivity and bond strength at high temperature
• TIM-818: High strength, thermally conductive adhesive, flash cure in 5 minutes. No mix, two part system to replace mechanical clips, fasteners or tapes in securing heat generating devices and heat sink.
| Property |
813 |
813HTC |
816 |
816HTC |
818 |
| Thermal Conductivity
W/mºK |
1.5 |
2.7 |
0.85 |
2.7 |
0.8 |
| Type/Cure |
One Part
Heat Cure |
One Part
Heat Cure |
Two Part
RT Cure |
Two Part
RT Cure |
Two Part
No Mix
Flash cure |
| Pot life(100grams) |
½ hr @ 80°C |
½ hr @ 80°C |
½ hr @ 25°C |
½ hr @ 25°C |
5 minutes
@ 25°C |
| Shelf life |
4 months
@25ºC |
4 months
@25ºC |
2 years
@25ºC |
2 years
@25ºC |
1 years
@25Cº |
| Dielectric strength, V/Mil |
460 |
460 |
420 |
420 |
570 |
| Max. Service Temperature ºC |
270 |
270 |
150 |
150 |
150 |
Electrically Conductive
Product Description :
Electrically conductive adhesives are designed with pure silver and resin and are typically used for microelectronic applications. All products feature very high purity, low ionic content, wide operating temperature range and excellent electrical conductivity even after exposure of 1000 hours at 150°C.
Typical Applications :
Die-attach, chip bonding, cold soldering and other micro electronics bonding applications.
| Property
|
897M-2
|
830M-1
|
| Thermal Conductivity W/mºK
|
1.5 |
2.7 |
| Type/Cure
|
One Part-Heat Cure |
Two Part-RT Cure |
| Pot life(100grams)
|
½ hr @ 80°C |
1hr @ 25°C |
| Cure Schedule
|
1 hr @ 100°C |
48 hrs @ 25°C |
| Shelf life
|
4 months @ 0°C |
1 Year @25°C |
| Volume Resistivity Ohm-cm
|
0.0004 |
0.002 |
| Max. Service Temperature ºC
|
140 |
140 |
Thermally Conductive Potting Compounds (TIM-PC Series)
Product Description :
TIM-PC series are pourable, filled epoxy resin systems offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. These compounds transfer heat rapidly, thereby eliminating hot spots and increasing the operating efficiency of most encapsulated devices. The low shrinkage design feature minimizes risk of damage to fragile components.
Typical Applications :
These products are designed for protecting components in applications such as densely packaged power supplies and heat generating components, integrated circuits, power and operational amplifiers, transformers and many types of semiconductors.
| Property
|
|
|
|
|
| Type
|
Silicone |
Epoxy Resin |
Epoxy Resin |
Epoxy Resin |
| Thermal Conductivity W/mºK
|
1.2 |
0.63 |
0.60 |
1.3 |
| Type/Cure
|
Two Part-RT Cure |
Two Part-RT Cure |
Two Part-RT Cure |
Two Part-RT Cure |
| Mix Ratio
|
100:100 |
100:12 |
100:100 |
Depends on Hardener |
| Pot life(100grams)
|
½ hr @ 25°C |
2 hr @ 25°C |
1-2 hr @ 25°C |
½ hr @ 25°C |
| Cure Schedule
|
24-48 hrs @ 25°C |
24-48 hrs @ 25°C |
24-48 hrs @ 25°C |
24-48 hrs @ 25°C |
| Shelf life
|
1 Year @25ºC |
1 Year @25ºC |
1 Year @25ºC |
1 Year @25ºC |
| Dielectric strength, V/Mil
|
460 |
480 |
415 |
460 |
| Max. Service Temperature ºC
|
140 |
120 |
110 |
140 |
|
